24.05.2024
BDN09-3CB
Характеристики BDN09-3CB
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СерияBDN
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ПроизводительCTS Thermal Management Products
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Package CooledAssorted (BGA, LGA, CPU, ASIC...)
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Attachment MethodThermal Tape, Adhesive (Not Included)
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Outline23.11mm x 23.11mm
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Высота0.35" (9mm)
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МатериалAluminum
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Power Dissipation @ Temperature Rise-
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Thermal Resistance @ Forced Air Flow9.6°C/W @ 400 LFM
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Thermal Resistance @ Natural26.9°C/W
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Type
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Shape
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Length
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Width
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Diameter
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Height Off Base (Height of Fin)
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Material Finish
Полная характеристикаСкрыть
Новости электроники
22.05.2024
21.05.2024